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How do CTE and Tg Relate to Reliability?

March 16, 2007

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Well, they relate, but lower CTE and higher Tg are not necessarily always the best. If we assume that the reliability issue is stress due to different thermal expansion between copper and the dielectric, leading to cracks, then we have to look for a solution that minimizes the difference in expansion between copper and dielectric over the range from room temperature (e.g. 20C)  to the solder shock temperature, let’s say 288C in the case of lead-free processing.
 
With copper having a CTE of approximately 17ppm/C, copper will expand (if unrestrained) 4,556ppm when heating from 20C to 288C (i. e. 268x17).
 
Let’s look at three cases:


Case 1:
 

Room Temp (C)

ΔT (RT to Tg)

Tg

ΔT (Tg to SST )

Solder Shock Temp (SST)

 

20

150

170

118

288

 

 

CTE below Tg (α1)

 

CTE above Tg (α2)

 

 

 

35

 

70

 

 

 

Expansion (ppm) from RT to Tg

 

Expansion (ppm) from Tg to SST

 

Total expansion (ppm) from RT to SST

 

5,250

 

8,260

 

13,510

 
Case 2:
 

Room Temp (C)

ΔT (RT to Tg)

Tg

ΔT (Tg to SST )

Solder Shock Temp (SST)

 

20

150

170

118

288

 

 

CTE below Tg (α1)

 

CTE above Tg (α2)

 

 

 

20

 

100

 

 

 

Expansion (ppm) from RT to Tg

 

Expansion (ppm) from Tg to SST

 

Total expansion (ppm) from RT to SST

 

3,000

 

11,800

 

14,800

 
  
 
 
 
 
 
 
Case 3:
 

Room Temp (C)

ΔT (RT to Tg)

Tg

ΔT (Tg to SST )

Solder Shock Temp (SST)

 

20

130

150

138

288

 

 

CTE below Tg (α1)

 

CTE above Tg (α2)

 

 

 

20

 

70

 

 

 

Expansion (ppm) from RT to Tg

 

Expansion (ppm) from Tg to SST

 

Total expansion (ppm) from RT to SST

 

2,600

 

9,660

 

12,260

 
And the winner is: Case 3 (expansion closest to that of copper), even though Case 3 has a lower Tg than Case 1 or 2. Comparing Case 1 and 2: Case 2 has a lower CTE below Tg than Case 1, but leads to a larger expansion differential than Case 1. The lesson here is that we have to consider both CTE below Tg and above Tg.



  Comments (6)Post a Comment
Title: CTE, Tg and reliability


Arithmetics alone is not enough here.
The copper in-plane with the layers is not relevant as CTE of the dielectric is constrained by the glass cloth.
The copper plated inside the holes has a minimum elongation factor of 15%...
In the Lead-free world it will be more important to look at the Td than at the Tg.
Roberto Tulman
www.eltekglobal.com


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