Plymouth, Mass. ― Weiner International Associates announces the appointment of John T. (Jack) Fisher, one of America’s leading electronic interconnect Technology Roadmap expert, as a Senior Associate.

 

Fisher’s industrial and association experience adds a new dimension to the services Weiner provides to the PWB, EMS, and packaging industries. It will avail clients the ability to evaluate and interpret global technology roadmaps in relationship to their own businesses and apply this knowledge to the development of their own focused paths forward.

 

With Fisher’s guidance, Weiner International Associates will expand its private client seminars to include technology roadmap assessment and formation in the entire PWB, EMS, and OED interconnect supply chain stream. It will assist and guide companies in strategic planning for future spaces through product development, merger and acquisition, partnering, and private sourcing.

 

Fisher has been associated with the PCB manufacturing industry for more than 44 years. He was a 31-year employee of IBM. He held senior management positions in manufacturing, development engineering, and maintenance and computer operations at IBM’s Endicott, NY, facility and at IBM’s Austin, TX, manufacturing plant.

 

After retiring from IBM in 1995, Fisher moved to a position as the Chief Technical Officer for the Interconnect Technology Research Institute (ITRI) that was located in Austin, TX. While under Fisher’s leadership ITRI published numerous technology reports that have had a significant effect on the PWB industry.

 

For the last nine years, Fisher has been a consultant on interconnect technology.

 

Fisher is one of the PCB industry’s leading expert on technology roadmapping. He became associated with the IPC roadmap in the early 90s and in 1994, while still with IBM, Fisher was appointed chairman of the IPC National Technology Roadmap for Electronic Interconnections ― a position he held until 2010. He also was a member of the iNEMI Technical Committee and is the chairman of the interconnection chapter for the iNEMI technology roadmap that was published in 1996, 1998, 2000, 2002, 2004, 2007 and 2009. Jack is also a member of the Applications and Packaging committee for the semiconductor industries SIA roadmap (also called the ITRS or International Technology Roadmap for Semiconductors). This combination of experience makes Jack one of the few people in the industry that can bridge the technology needs between all of the roadmaps.