San Jose, Calif. – SEMI reported that worldwide sales of semiconductor manufacturing equipment totaled $15.92 billion in 2009, representing a year-over-year decline of 46 percent. The data is available in the Worldwide Semiconductor Equipment Market Statistics (SEMS) Report, now available from SEMI.

 

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings and bookings figures for the global semiconductor equipment industry. The report, which includes data for seven major semiconductor producing regions and over 22 product categories, shows worldwide billings totaled $15.92 billion in 2009, compared to $29.52 billion in sales posted in 2008. Categories cover wafer processing, assembly and packaging, test, and other front-end equipment. Other front-end includes mask/reticle manufacturing, wafer manufacturing, and fab facilities equipment.

 

Spending rates declined by double-digits for all the regions tracked in the WWSEMS report, with the steepest contraction reported for Japan. In the overall global market, Taiwan was the region with the largest amount of 2009 spending with $4.35 billion in equipment sales. In second place, the North America market had $3.39 billion in sales, followed by South Korea, Japan, Rest of World, Europe and China. (The Rest of World region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets).

 

The global wafer processing equipment market segment decreased 46 percent, the assembly and packaging segment decreased 31 percent, and the total test equipment sales decreased 55 percent. Other front-end equipment sales declined by 44 percent in 2009.

 

For more information, visit www.semi.org.