Londonderry, NH—Polyclad Laminates Inc., a Cookson Electronics PWB Materials & Chemistry business, has introduced a new line of polyimide copper-clad laminates and prepregs. Based on bismaleimide (BMI) type resin, the systems are specially engineered for use in rigid, high temperature PWB applications used in military, aerospace, avionics, burn-in, oil drilling and other demanding electronics market segments. The pure polyimide materials contain no blended or "co-polymer" chemistry and are ideally suited to provide optimum reliability and extended performance in extreme operating environments, including hostile PWB assembly procedures.

Available as Polyclad GI-785 (non-flame retardant) and Polyclad GI-787 (UL V-1 flame resistant), the laminate and prepreg systems exhibit high glass transition temperatures (Tg) of 260°C for maximum thermal performance and low Z-Axis CTE to ensure electrical integrity. Product surface quality is unmatched in the industry due to the exclusive use of CAC; Class C standard that eliminates potential problems associated with resin spots or other surface defects. Superior laminate multi-ply, balanced laminate constructions contain premium glass fabrics and a low resin content to minimize curl or warp while optimizing dimensional stability (DS). Consistent prepreg performance is achieved through advanced melt viscosity testing.

Engineered to the most stringent manufacturing standards, Polyclad GI-785 and Polyclad GI-787 systems are non-MDA curing and meet OSHA 1910.1050 requirements. Copper bond peel strengths are equivalent to FR-4 materials using special profile foils.

Upon final UL certification as ANSI Type GPY, the systems will be listed as PCL-GI-785 laminate / PCL-GIP-785 prepreg and PCL-GI-787 laminate / PCL-GIP-787 prepreg. All materials meet 4101A, -40 and -41 requirements and are compatible with all commonly used polyimide process techniques.