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Like all good boys, I was at the APEX show and got to check out some of the so-called new technologies. All well and good, but I could not help wondering when we are going to start really thinking out of the box we are so firmly locked into.

I know this sounds harsh, but quite frankly, we know all about RoHS. Get over it. We get it! Lead free, right? Why are we still giving seminars about this?

You know, to be fair, maybe I’m just spoiled because I hang out with people who are so far out that they don’t even know there is a box.

One of my associates, for example, is Robert Tarzwell. Now, after talking to Bob for a while you really start being cynical about how slow our printed circuit board technology is actually evolving. Which, frankly, is at glacier pace, or the way Tarzwell describes it, What does a PCB engineer riding on a turtle say? Give up? WEEEE!

But look, the time to innovate is now. If you want your company to survive this economy and then to thrive in thrice in this market, you are going to have to get truly innovative…you are going to have to smash your way out of that proverbial box.

Just to whet your appetite, I’ll give you a taste of some of Tarzwell’s newly invented technologies. Let me remind you that everything described below has been developed and is ready to be installed in just about any board shop, if, and it’s a big if, you are ready to meet the future.

So, here ladies and gentlemen, without further ado straight from Tarzwell’s recently issued catalogue are 19 new technologies to “innovate” your company into the future:

1. High reliability circuits with thermal cycling in excess of 2,500 cycles. No extra equipment required and minimal change to the manufacturing process of the boards. Used in automotive applications, aircraft, space circuits medical devices, heavy duty computers, and any tough extreme thermal cycling applications.


2. Outer space printed circuits. A new technology to lower out gassing of the circuit in vacuum and outer space applications. No new equipment needed and minimal change to the production process.


3. Printed metal filed circuits with a unique catalyst conversion to semi-solid metal, HDI technology, very fine lines, and via holes. A huge potential for future build-up technology utilizing photo imageable dielectric material. This extremely advanced invention creates very fine lines in a single, double-sided, multilayer, and even HDI circuits with less then half the equipment and process’ of a typical shop. No laminators, no etchers, no plating line, no drilling, no dry film laminators, low pollution, and very inexpensive manufacturing cost.


4. Mems devices on Fr4 printed circuits. A newly invented 3-dimension plating technology on the surface of the printed circuit board. Movable miniature devices, such as relays and switched microphones, can be created right on the surface of the board. This new technology is very advanced with some new equipment required and significant change in circuit production required. This groundbreaking technology is presently in R&D with the first product tests showing very positive results.


5. High voltage printed circuit technology allows the manufacture of boards with as high as 30,000 volts rating. Some minor equipment may be required and a minor change in production process is utilized. This technology has been manufactured for eight years and is well documented. It can be implemented quickly at a low cost, typically 3x in sales price.


6. Very thin multilayers. A new technology that produces a very thin multilayer, such as a 12 layer multilayer board as thin as 18 mils. Some relatively inexpensive new equipment may be required and a minor change to the process is involved. A very well proven technology, it has being manufactured for two years by a major PCB facility and is ready to implement quickly. Offer your customers this new exciting invention and create a new market presence to drive up your sales.


7. Very fine lines. Quickly provide the ability to manufacture lines and spaces as fine as 1.5 mils. Minimum equipment may be required, as well as a change in production process and materials used, but it is not that difficult to implement. Some new manufacturing ideas need to be understood and implemented.


8. Micro HDI circuitry. Very fine lines to 10 microns and laser drilled microvias. This very advanced technology has been sold for two years by a major PCB shop, requires a reasonable investment in equipment, and a six month transfer technology time frame. The micro HDI is the way of the future. Invest now and become the market leader with very high returns.
   
   
9. Embedded components put real 0201 and 0402 components inside a circuit board. The new bleeding edge technology facilitates the embedding of small components such as resistors, capacitors, discreet chips, and even inductors right in the middle of a multilayer. The technology is proven and may require a minimal investment in equipment and materials. Be one of the first to offer this extremely high density packaging Idea. The market is ready and willing for this new high density advancement.


10. Impedance vias. New advanced invention creates a via with known impedance, such as 50 ohms. No new equipment and quick application time. A good sales tool for additional high speed and RF circuits orders.


11. Heavy copper printed circuits. Up to 20 oz. per layer, single- and double-sided, as well as multilayers. The technology is very well proven and has been in production for 12 years. The never-before-released information covers all aspects of design manufacturing and selling of high power circuits. No new equipment required and only minor change to production process.


12. Three-dimension copper circuits. New invention creates three dimensional structures on the surface of the board. Create multilevel seating platforms for chips or components. Used in the chip pre-testing industry and power/led circuits. Well proven and sold for three years. No new equipment required and only minor changes in process.


13. Multilevel heavy copper circuits create two to five different copper thicknesses or levels, all on the same side of the board, all inter connected and intertwined. No new equipment required and only minor change in production process. Has been in production for ten years, is well sorted out, and quick to market. Very high sales potential with 5 to 10x sales price over similar, normal PCBs.


14. Buried heavy copper. This technology creates a heavy copper circuit, but with most of the thick copper inside the board and only a 1-2 oz. surface copper is visible. The main problem with heavy copper is the high profile of 8-12 oz. of copper does present some problems for assembling some components. Has been in production for eight years. No new equipment is required and only a minor change to production process. Good potential sales to power supply companies.


15. High-powered LED power boards with metal cores and high-reflectivity, special white marking ink. Utilizing thin thermal dielectrics, creates a high demand, higher-priced circuit. The world is switching to LED for lower energy use. Be main stream with this easily implemented technology with no new equipment and add to your sales.


16. Low CTE boards. A new approach to the problem customers have with chip carriers, BGA, and CTE expansion, the new technology utilizes low CTE cores of Kevlar invar and molly metal cores and a new readily available laminate. Some new equipment may be required and a minor change in materials and process is utilized. Generate extra high profit sales with this needed technology.


17. High resistance and impedance circuits. A new technology that produces a special circuit board for very sensitive Pico voltage circuits. Used by universities and scientific applications for measuring very small voltages. Has been in production for two years. Some minor equipment may be required.


18. Flexible fr4 circuits. Using thin, specially prepared fr4 laminated sheets to manufacture bendable boards. Sold as bend-to-fit type flex circuit where limited bend cycles are involved. Easy to implement, no new equipment required, and no new materials needed. Quickly augment your sales base and enter into the flexible market with this unique product. Creates very easily sold jumper strips to connect assembled circuits together. Much less expensive than a typical kapton flex circuit. Quick learning cycle and to market time.


19. Thermal core multilayers. Utilizing a new technology, a method is created by which heavy copper heat sinking cores are produced without drilling and without the problems associated with copper spurs and drill outs from to many clearance holes. Quick time to market and no new equipment required.

So, there you have it — 19 innovative new technologies that can change the way you do business, courtesy of my friend, Robert Tarzwell.