Hopefully by now, you have learned that IPC has recently released new revisions of IPC-A-600H, Acceptability of Printed Boards, and its companion document, IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards. Additionally, IPC J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610E, Acceptability of Electronic Assemblies, were also revised and released. More than five years of new board technologies and processes have brought significant changes to these specifications. Kudos to the volunteers that made these revisions possible and to all the volunteers working on behalf of the industry!

Here is a very short summary of the work of our volunteer groups:

Printed board design
IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design—The IPC 1-10b Task Group discussed future revisions, including high current transients, flexible printed boards, microvia structures and new printed board material types.

IPC-2221A, Generic Standard on Printed Board Design—The IPC 1-10c Task Group reviewed a future Addendum that would represent an “overhaul” of existing test coupon designs from section 12.4. A new A/B-R plated-through-hole evaluation coupon design has been approved as a replacement for the legacy A and B and A/B designs.

Base materials
Amendment 1 to IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards—The 3-11 Laminate/Prepreg Subcommittee addressed changes and additions for this amendment. The 3-11g Corrosion of Metal Finishes Task Group reviewed the proposed creep corrosion test method that will use mixed flowing gasses to accelerate corrosion formation.

Amendment 1 to IPC-4562A, Metal Foil for Printed Board Applications—The 3-12a Metallic Foil Task Group discussed the use of non-contact copper foil surface roughness measurements. “Skin Effect.”

Amendment 3 to IPC-4412A, Specification for Finished Fabric Woven from “E” Glass for Printed Boards—The 3-12d Woven Glass Reinforcement Task Group is acquiring 1 GHz permittivity (dielectric constant) data from E-glass manufacturers to determine the impact of E-glass formulation variations. Also, six new weave styles are proposed for addition to the IPC-4412A.

Fabrication processes
IPC-4552A (ENIG), IPC-4555 (OSP) and IPC-4556 (ENEPIG)—The 4-14 Plating Processes Subcommittee reviewed activity on three surface finish specifications: a) Full revision A of IPC-4552 where upper spec limit will be set for immersion gold thickness; b) Final Draft of IPC-4555 for start of ballot process and c) Round robin test program for working draft of IPC-4556.

Cleaning and coating
IPC-SM-840E, Qualification and Performance Specification of Permanent Solder Mask—The 5-33b and D-13b Task Groups met jointly to review proposed changes to the working draft of IPC-SM-840E that will incorporate solder masks performing as flexible cover materials.

IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings—The 5-33c Task Group continued developing the first working draft of Revision A to IPC-HDBK-830, outlining plans for new automotive and medical industry application sections for conformal coatings.

IPC-HDBK-850 (1st working draft) —The new 5-33f Potting and Encapsulation Task Group met to review a strawman draft of a new guideline on potting and encapsulation materials and processes. The group reviewed terms and definitions as well as various material processes.