As you read this, IPC Printed Circuits Expo is less than a month away. On April 1-5, exhibitors and attendees alike will meet in Anaheim, California, to see new products, attend technical conferences and standards meetings, hear presentations, brave sales pitches-and most importantly catch up with old friends.

This year promises a show more focused on attendee needs than ever before. The technical conference has added conversation corners on the show floor. These corners will allow attendees to converse with paper presenters in a less formal manner. It will also help keep commercialism out of technical conference sessions and on the show floor where it belongs.

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This year's Expo also marks the introduction of panel sessions. These sessions will only be successful with audience interaction. IPC is requesting your input into each session. For example, the Small and Medium Enterprise features panelist who will discuss small business issues. But the audience will be treated as a panelist, too, as your opinions and questions will be sought. There are three other panel discussion sessions for you to choose from: plating, embedded technologies, and electrical test. Free forums will focus on advanced design techniques, global competitiveness, industry market trends, a Suppliers Council roadmap and lead-free compliance issues.

Below is a summary of this year's IPC Printed Circuits Expo highlights. In addition, we have provided a series of product and process previews that will allow attendees to decide what they want to see before the myriad distractions begin. Check out the technology being offered at this year's show-you might be surprised at what you find!

Keynote Addresses

Former Hadco CEO Andy Lietz tops the keynote address list with a presentation entitled, "Succeeding in the PWB Business in the 21st Century" on Tuesday, April 3, from 9:00-10:00 a.m. A forceful speaker and industry visionary, Lietz is best known for turning Hadco into one of the largest PWB manufacturers in the world. His experiences on both sides of the acquisition table should make this a memorable keynote.

Wednesday April 4 at 9 a.m. marks the second keynote session, "Key Factors in Purchasing PWBs: The OEM Perspective." Panelists from OEM and EMS companies answer questions on every PWB fabricator's mind: What influences the buyer of printed circuit boards? Is price more important than value? Why do North American companies buy offshore? Attendees are invited to participate in this session, offering a chance for both panelist and attendee to understand the issues each is facing.

Finally, on Thursday April 5 from 11 a.m.-12 p.m., Michael Hawley of MIT will look at what our technological future might hold. In his presentation, "Creating Things That Think," Hawley looks at how our furniture, clothing, appliances, doors and automobile will all be "smart." From shoes that monitor our health to refrigerators that count calories to underwear that controls the thermostat, Hawley's vision of the future is a reminder that imagination is a critical component of business.

All keynote addresses are free of charge and open to all.

The New-and-Improved Gala

Remember IPC Expo galas of the past? Whether you recall them with fondness or are still trying to regain your hearing, this year's celebration promises to exceed expectations. Dubbed "The Station Celebration," the gala will be held on Wednesday, April 4, at 6:00 p.m. Located in the third-floor ballroom at the convention center, the gala offers several environments for all tastes.

The 10-person band, Splash, will do it's best to make waves on the dance floor. What would a gala be without dancing? You can still count on refreshments, food, and music-but IPC hopes to raise the bar by adding interactive diversions such as pool, virtual golf, karaoke, and an assortment of video games. Attendees and exhibitors will also have a relaxed, quieter environment where they can catch up with colleagues or customers from 6-7:00 p.m.

The price of admission is $60, offering an affordable "networking opportunity" for attendees and exhibitors alike.

Tutorials & Workshops

IPC has gathered a host of world-renowned industry experts to present educational programs at Expo. Offering over forty courses, attendees can explore PWB technology, including troubleshooting, materials, microvias, design, and test.

Tutorials are full-day courses that run from 8:30 a.m.-4:00 p.m., while Workshops are half-day courses. On Monday, odd-numbered workshops are from 8:30-11:30 a.m. and even-numbered workshops are from 1:30-4:30 p.m. On Thursday, all workshops are from 8:30-11:30 a.m. Register for a single event "a la carte" or take advantage of IPC's tutorial package, which includes admission to the technical conference plus one tutorial of your choice.

Product Preview

While there are too many exhibitors to feature each one's new products, CircuiTree is giving its advertisers a chance to make a great first pre-show impression. Since our advertisers keep this magazine coming to your desk month after month, we invite you to take a look at their new equipment and materials while in Anaheim.

Quantum Performance Group-Booth #512

At this year's IPC Expo, the Quantum Performance Group will offer Imaging 2000T, the most complete and accurate imaging study the printed wiring industry has every seen. Hundreds of companies from around the world were surveyed and interviewed. It covers photoplotting, phototools, photoresists, exposure equipment, solder masks, and photodielectrics used in PCB and HDI fabrication. It is an invaluable aid to those fabricators contemplating changes or seeking solutions and options to meet changing customer needs, or those suppliers evaluating market opportunities. Visit the Quantum Performance Group at Expo or visit www.quantumpg.com.

Billows Protocol-Booth #420

Billows Protocol provide a complete range of registration and tooling systems for PCB manufacturers. IPC will see the launch of the latest version of the Automatic Post Etch Punch. The manual load and unload APEP has been launched to meet the demand from the smaller PCB manufacturers who do not have the high volume requirement serviced by our automated machines. Other products on show at IPC will include Artwork Punches, Press Plates, Separator Plates and Tooling Pins. For further information call Colin Billows, Billows Protocol Ltd. at 44-1908-315539, or email: colin@billowsprotocol.com.

Maintech, Inc.-Booth #1053

Maintech, Inc. is pleased to introduce its new DFL 2032 automatic dry film laminator. The DFL 2032 will have a standard 48" front conveyor and modified centering device to handle heavier panels. For variation in panel thickness, we have designed independently moving vacuum platens for accurate film placement. Additional features include: thickness measurement device, thin board device down to three-mil core, thick panel up to 500 mils, touch screen control and display, PIC (Process Information Control) package, crowned rolls, dual durometer rubber rolls and an anti-wrinkle system.

Frontline PCB Solutions-Booth #1023

Frontline PCB Solutions launches the ODB++ Communicator tool, enabling all staff in a fab to view, exchange, and discuss ODB++ tooling data. The wealth of information available in ODB++ databases can now be shared by all staff members-from the tooling department to engineering and production, and to sales and marketing as well. This allows diverse staff to view, discuss, and resolve production matters easily and swiftly.

The web-based Communicator is comprised of a Viewer and a Messenger. The Viewer shows tooling data as layers or panels, as it appears before committing resources to production, and enables different measurements to be made on the layer. Contact Efrat Bar-Sella

at 972-8-9322-183 ext. 139, or email: efrat@frontline-pcb.com.

Everett Charles Technologies-Booth #3017

The A4a, an automated flying probe tester from Everett Charles Technologies, will be demonstrated at IPC 2001. The double-sided test system for complex bare-board evaluations is the fastest flying prober in the field and offers extraordinary throughput for flying probe applications. Its advanced configuration, patented measurement method, and automation features are designed for qualifying up to a row of boards in tandem. Operating up to sixteen moving probe heads made of ultra-light materials and featuring two alignment cameras, the A4a is a compact low-profile machine intended for middle-size capacity production lines.

Dosco Products Co.-Booth #212

Dosco Products Co. brings to you the Piergiacomi AMM10 Innerlayer Registration Machine and IPM10 Post Etch Punch system of equipment to produce multilayers with the outmost precision. This new but proven technology aligns and secures the innerlayers to each other by "spot welding" them together efficiently and economically with added benefit of allowing pinless lamination. For more information, call the Dosco Products Co. at 603-594-0005.

Test Technology International-Booth #2831

Test Technology International, Inc. (Carson City, Nevada) is pleased to announce the debut of the TTI Series 5800, 70-mil dual access universal grid bare board test system. The Model 5800 is designed for volume production and ease of use. Built with the end-user in mind, the Series 5800 menus are easy to navigate using a mouse in a Windows environment. Comprised of 56,000 total test points on full 14.4" ax 10.0" top and bottom grids, the Series 5800 is ideal for testing of a wide range of dense PCBs. For more information, call Don Lamers at 775-885-8015 or email: test@ttiusa.com.

Barco-Booth #2662

Barco will be demonstrating its innovative hardware system solutions. Silverwriter photoplotter: the plotter with the highest up-time record around now handles multiple film sizes. Argos AOI: productivity, versatility and ease-of-use in AOI. Gemini LDI: the first and only automated LDI system with a solid state laser makes LDI a profitable reality for your shop.

In addition, Barco will offer its suite of CAM and electrical test software. Autotest combinational testing uses the strengths of both fixture and fixtureless testers to test PCBs more economically than using either tester type by itself. Autoplot Server allows the customer to fully automatically drive a Barco Silverwriter from any third-party CAM system. JobManager is an application to organize, control and archive the customer's front-end operations.

Cimnet Systems-Booth #812

Paradigm Specialized ERP software combines the full data integration of ERP software and the specialized knowledge of the PCB industry in a single package. Now more than ever, Cimnet System's new Paradigm Version 2.1

allows you to rethink the way you do business. In addition to brand new

features like Plan by Schedule, which integrates forecast orders and

automates scheduling tasks, Version 2.1 packs enhanced features system-wide and advanced windows functionality in all modules. Stop by Booth #812 at IPC Expo or Booths D15 and D16 at CPCA and see for yourself the way your business should run.

Sentrex-Booth #432

Sentrex offers market-proven solutions specifically formulated to deliver high yields on fine line HDI microvia boards and fine line flexible circuit boards. Our exclusive technology for damming via holes and bonding flexible circuit coverlays will give you the ability to dramatically increase your yields in the shortest possible time. Visit us at EIS Booth #432.

W.L. Gore & Associates-Booth #1613

W. L. Gore & Associates, Inc. launches the Microlam family of organic dielectric materials for chip package substrates and printed circuit boards. Microlam dielectrics are built upon expanded polytetrafluoroethylene structures impregnated with various filled resins. Microlam 200 is engineered with an extremely low loss tangent for high frequency, laser HDI PWBs or RF module applications. The CTE of Microlam 400 is isotropically matched to copper, allowing fabrication of reliable, fine-pitch chip package substrates. Superior planarization, mechanical reliability, and microvia hole quality make Microlam 600 the circuit designer's choice for PWB build-up layers. For more information, visit www.gore.com/electronics, call 1-800-445-GORE, or fax your request to 1-800-757-4673.

Insulectro-Booth #450

Insulectro, the leading Supply Chain Manager of Engineered PCB Materials, will be highlighting their new ePredator proprietary Internet software. See first-hand how PCB manufacturers are staying ahead of the game by logging on Insulectro's ePredator to their customized web page to place orders, check status on existing orders, review product availability and track accounts payable.

In addition to featuring their eCommerce capabilities, Insulectro will be presenting all the latest technologies in copper-clad laminates, prepregs, dry film photoresist, PCB chemistry, backup and entry materials, copper and aluminum foils, PCB specialty tapes, precision drills and routers and lamination assist materials.

Plating Engineering and Chemicals Co.-Booth #3247-8

Plating Engineering and Chemicals Company Ltd. (PENC) is your surface finishing partner and is renowned for the design, construction quality and efficiency of its wet process, plating and anodizing plant including full design of electroplating facilities, installation, commissioning and after sales service. PENC maintains a manufacturing base in China with a service unit in the U.S. Please visit us at booth 3247 and 3248.

Cedal USA-Booth #2631

Cedal USA introduces the CU-2424, which allows for pinless lamination of multilayers and sequential lamination build up technology. Three different processes take place in one unit, layup, layer to layer alignment and bonding. This process eliminates the added tolerances associated with punching and pin lamination. Mechanical tolerance variations such as, tooling hole size, lamination plate bushing locations and pin size are eliminated. Utilizing existing technology and stringent tooling practices will guarantee at best only 2.5-3 mils of layer to layer registration. The CU-2424 will align innerlayers to within I0.5 mils. The system will process a wide range of panel sizes in one compact unit.

AccuSystems-Booth #2451

AccuSystems is pleased to announce the release of the LM-2000 Laser Marking System at the IPC Expo 2001. The LM-2000 is designed to provide CNC marking of PCBs anywhere on the panel. Image serialization, date-coding, bar-coding and lot-coding are the target application for this new product. Combining a high-speed laser tool with AccuSystems world class motion control software has resulted in a product that can mark 16 images with individual serial numbers in as little as 15 seconds. The product will be on display at the IPC Expo 2001, Booth #2451.

B. Bacher-Booth #3043

B. Bacher, manufacturer of registration and exposure solutions, introduces the PEPS 700 Post-Etch Punch System for innerlayer registration. The PEPS 700 is a fully automatic unit, which can be used either completely in-line or with standard loading/unloading equipment. Automatic tool setting with software selected, automatically detected or bar-code input of panel size minimizes setup to less than a minute. The unique transport system allows handling of thin cores down to 0.002" (0.05 mm), and a throughput of six to eight panels per minute; well suited for high volume and small lot production.

Multiline-Booth #622

The XRT-1000 is an x-ray tooling and inspection system designed for post lamination drilling of multilayers. Any misregistration of layers after lamination can be minimized by using x-ray to locate internal copper images and drill new tooling holes for pinning on the drill machine. The XRT-1000 x-rays every panel and drills new tooling holes based on the panel's individual registration characteristics. The XRT-1000 also has a built-in inspection system, which provides SPC data on each panel processed indicating the spread value between the panel targets and the system reference positions. The data is presented to the operator on the system monitor graphically as a plot of "spread" compared to upper and lower tolerance limits input during the job set-up.

Multiline is also pleased to introduce the Multiframe, a complete draw replacement style of frame with interchangeable glass that adapts to existing exposure units. This unit can be utilized for inner and outerlayers as well as soldermask. This frame is designed to give precise front to back registration of innerlayers and outerlayers with long term repeatability. For more information, call 631-249-8300.

CEMCO-FSL-Booth #2650

Waterlooville, UK-CEMCO-FSL introduced the first in a series of systems designed for specific residue removal tasks. The new hole cleaning system is designed using a number of cleaning stages to insure removal of residue from panels after drilling to reduce the possibility of plating voids. The panels are cleaned using a unique Dynamic Airknife Drilling Debris Removal module followed by high volume Fluid Knife water wash prior to transport to a deburring unit. CEMCO-FSL's patented air knife and "Fluid Knife" technology is used throughout the new system. The new system will be introduced at the IPC Expo.

Camtek-Booth #3038

At this year's IPC Expo, Camtek features the Vega , a new Automatic Material Handling AOI system. Based on the Orion 804, Camtek's Vega has several unique features: Pinless alignment of panels, edge clamping, and large working table 24" x 30". Among the models available to choose from: Automation ready, accepts third-party AMHS or InspectifyT mode of operation (inspection and verification on the machine); basic AMHS, tray to tray inspection with interleaf separation; inline AMHS one side, includes registration unit; and inline AMHS two sides, includes registration unit and flipper. Automation solutions combine proven technologies from Camtek and AmTech USA-part of the Excellon Corporation.

Lloyd Doyle-Booth #3025

Lloyd Doyle will introduce a Laser/CCD Based Automatic Optical Test System at IPC Expo. Lloyd Doyle will be showing the new AOT system, phasor at Booth #3025. This brand new development combines laser illumination with a new CCD based electronic camera to provide an image acquisition particularly suited to low contrast substrates. Available in different resolutions, phasor is capable of scanning PCBs with lines/spaces down to 25K at high speed. phasor is available in a range of formats for panel sizes up to 1m x 2m. It is also available with an automated panel handling option.

OTS America, Inc.-Booth #2617

OTS America will introduce a laminator specially designed for thin core PCBs. It features many intelligent devices like a centering device, a vacuum plate and a gripper feeder, allowing it to laminate thin core up to 0.07t. This machine is also equipped with a very fine control device to manage each step of the operation.

Hitachi Digital Graphics (USA), Inc.-Booth #635

Sunnyvale, CA-Keep your eyes peeled for Hitachi Digital Graphics at IPC 2001. We will feature our brand new extra large panel size drilling machine, UV/CO₂ laser drilling machine and hole location inspection equipment. Look for the new product release in CircuiTree's April edition, and at IPC 2001.

Innoveda-Booth #1429

Looking to increase yields? Improve quality? Then visit Booth #1429 and see FabFactoryT, Innoveda's latest addition to its suite of manufacturing and design solutions. FabFactory is easy to learn and easy to use so you can increase throughput and get to market faster. With FabFactory you can reduce tooling time, streamline panelization, even read ODB++, all without custom scripting or intensive training. The latest release of CAM350T, an industry mainstay, will also be shown. CAM350 enables PCB designers to assess boards for "manufacturability" before they hit the manufacturing floor, thus shortening design cycles and decreasing scrap.

3M-Booth #1012

The ScotchgardT Phototool Protection System combines a high-precision coater with 3M's Scotchgard Phototool Protector: a solvent-free liquid that gives phototools an ultra-thin (3.0 microns), optically clear, uniform shield against abrasion, liquids and static charge in 2.5 minutes or less. The liquid solution is converted to a solid using a cool UV light source that preserves the dimensional stability of the phototool. For additional information contact 3M at 1-800-407-0410 or send an e-mail to phototool@mmm.com.

Atotech-Booth #1015

As the industry moves from traditional HASL to new lead-free surface finishes, SilverFinish ST offers both high productivity and consistency to the PWB manufacturer and a reliable alternative for tin/lead to the assembler. With short process times and low operating temperatures, the SilverFinish ST process is ideally suited for continuous production in the new Atotech Horizon SilverFinish ST horizontal lines. It provides a dense deposit incorporating an organic to seal the surface. The typical silver layer thickness is 8-16 microinches (0.2-0.4 microns), which allows for handling and excellent aging behavior.

Technic, Inc.-Booth #441

Technic, Inc. introduces a complete line of wet processing chemistry specifically developed for printed circuit board fabrication. A world leader in plating chemistry and equipment for over 50 years, Technic maintains a reputation for the finest quality chemicals backed by a nationwide technical field support staff and exemplary customer service. This product line supplements an already extensive offering of specialty electroplating processes, positioning Technic as a single-source supplier to companies engaged in printed circuit fabrication. Included in this introduction is an array of consumable and process chemistry products such as fluxes, developers, strippers, oxide, electroless copper and direct metallization.

PhotoMachining, Inc.-Booth #3628

PhotoMachining, Inc. offers a porous ceramic vacuum chuck designed for holding flat flex materials, thin films and other flat samples. Pore sizes less than 25 microns assure uniform suction and holding power for even the smallest parts. The chuck is available in standard 6" and 12" square sizes. Custom sizes and shapes, including circular chucks, are available on a special order basis. Chucks are manufactured flat and parallel to better than 0.001" over the entire surface. PhotoMachining also provides contract laser manufacturing services and designs and builds custom laser-based manufacturing equipment.

Etec Systems-Booth #615

Etec Systems, Inc., an Applied Materials company, announces the new DigiRiteR 2600e Laser Direct Imaging System. The new system features enhanced resolution and new production management features as part of Applied Materials' Total Solutions offering for High Density Interconnect. Total Solutions has been recognized as critical by leading semiconductor manufacturers who look to Etec and Applied Materials for data management tools, process technology, and yield improvement along with process equipment. As the world's leading supplier of semiconductor manufacturing technology, Applied Materials has developed Total Solutions to meet the needs of device makers worldwide. Now Etec brings Total Solutions to the HDI industry with the DigiRite 2600e LDI system.

Orbotech-Booth #1031

The Vision-300APT AOI series is a major performance upgrade to the proven Vision-300T series. Building on the advanced capabilities of the product line, the Vision-300AP delivers innovative new software and hardware features including dynamic width matching, advanced registration algorithms, accelerated scan speed, enhanced motion control and improved temperature regulation. Available options such as extended table sizes, dual vacuum tables, etching process analysis and teleservice enable further system optimization. The Vision-300AP series is available in four models to accommodate varying application and throughput requirements. Field upgrades are provided to Orbotech's service contract customers as an inclusive part of their contract.

Park Electrochemical-Booth #2243

Park Electrochemical Corp. announced the globalization of the manufacturing and marketing of its digital broadband product line, particularly its Nelco N4000-13 and N4000-13SITM products. The company's digital broadband product line is used for sophisticated high-speed, low-loss, high bandwidth electronic infrastructure applications, especially in the telecommunications, networking and internet industries.

Vantico-Booth #1635

Probelec 81/8000 is a new high-end laser ablatable dielectric dry film material from Vantico Inc. It is available in thickness of 1 and 2 mils, and is designed for resolutions beyond 50 microns. The film is structured through conventional wet processes. The structure formation is uniform with subsequent copper plating resulting in peel strength in excess of six pounds. For more information please come see us at Booth #1635.

Teknek Electronics-Booth #1019

Teknek Electronics, the world leader in contact cleaning technology, is launching a new range of automation machines for the PCB market at IPC 2001. The range of machines is setting new standards in automatic handling, laser measurement and laser marking of PCBs. The combination of Teknek's automation machines and the industry leading contact cleaning technology, places Teknek as the number one choice for PCB yield improvement worldwide. To see the technology in action, visit us at IPC Expo or see Teknek on the Web: www.teknek.com.

Rogers Corporation-Booth #1046

Flexible circuit materials from Rogers Corporation include new products for making smaller, lighter flexible circuits used in wireless equipment designs. Rogers' R/flexR high performance materials and covercoats continue to support the fabrication of conformable and flexible circuits with finer lines and higher densities. Also with applications in the hard disk drive market, Rogers' flexible circuit materials meet demanding technical needs of fabricators and OEM designers. Products include: chemically resistant and highly flexible R/flexR 1000 laminates; R/flexR 2005 series laminates that meet high reliability and UL criteria; and R/flexR Crystal laminate, an epoxy-polyimide system with high bond strength and low moisture absorption.

MicroCraft-Booth #3221

High speed testing of BGA, flip-chip and hybrid technologies can be accomplished with the MicroCraft MF series tester. Combination of fixtured bottom and moving probe top allows for high speed testing of very small pads. To increase productivity, a conductive rubber fixture can be added. MicroCraft's MF series tester allows you to test pads down to 30 microns (0.0012") on the top, while using conventional fixturing for the bottom. This is the first of its kind to merge the accuracy of a moving probe tester with speed of fixturing technology. MicroCraft will be demonstrating this unit at IPC Expo 2001, booth #3221.

First EIE-Booth#3431

First EIE SA announced that it has received six confirmed orders by the end of 2000 for its new RP500 ultra-fast photoplotters. Two units have been installed already and have been running successfully for the last four months. The RP500 is a large size, fully automated photoplotter with 512 beams, precisely equalized. Several other unique features like an autotest sequence at power-up or sensors to monitor temperature and humidity contribute to its high reliability and accuracy.

Jetmask-Booth #1219

At IPC Expo, Jetmask will launch their exciting new Direct Legend Printer (DLP), the first single-step legend printer on the market. The printer produces legend direct from data and requires no curing after application. Because the system has virtually no set up time, jobs can be processed faster, and because it works direct from data, using no films or screens, boards can be serialised with a unique number or code. These features make the Jetmask DLP unbeatable on small batches, whilst remaining very competitive for medium and larger volumes. For further information, visit www.jetmask.com or call +44-1763-249-431.

Coates Circuit Products-Booth #3035

Coates Circuit Products is introducing these new products: The next generation LPI Flex Coverlay, Imageflex¹ XV601T-2 offers greater flexibility, improved electrical characteristics and definition to the finest feature.

The XV100 series is a new range of two-part thermal legend inks for ultra-fine lettering, excellent adhesion, abrasion resistance and colorfast properties.

Coates is expanding the Imageline¹ XV750 LPI Etch Resist range with a screen printed or roller coated Laser Direct Image version with <2-mil line and space definition.

The Imagecure, XV501T-4 LPI soldermask range is also growing with a full range of colors, 2-mil web capability and Ni/Au, immersion tin and silver resistant.