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SPECIAL Expo Product Preview

February 1, 2002

ARTICLE TOOLS
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As the printed circuits industry attempts to rebound from last year's dismal sales, it is time to prepare for what many consider the most important event of the year: IPC's Printed Circuits Expo 2002. The Show is set to open in Long Beach, California, on March 24-28 at the Long Beach Convention Center.

While there are too many exhibitors at this year's IPC Printed Circuits Expo to feature each one's new products, CircuiTree is giving its advertisers a chance to make a great first pre-show impression. Since our advertisers keep this magazine coming to your desk month after month, we invite you to take a look at their new equipment and materials while in Long Beach. It's also a good opportunity to see the innovations many PCB suppliers have made in anticipation of improving market conditions.



3M -- Booth #2030



The Scotchgard Phototool Protection System gives phototools an ultra-thin (3.0 microns), optically clear, uniform shield against abrasion, liquids and static charge while maintaining resolution and preserving dimensional stability. For additional information, contact 3M at 1-800-407-0410 or visit www.3M.com/phototool.


ACS Technologies -- Booth #2034



ACS Technologies Inc. eliminates curing bottlenecks with revolutionary, patent-pending IR Technology. ACS's TruCure system yields final LPI cure times of four minutes. The Legend system yields 30-99 second cure times. The TruTack yields LPI tack drying time of two minutes. Visit www.trucure.com, or call ACS at (501) 846-2403.


Advanced West/Fabtech -- Booth #231



Fabtech is a leading supplier of wet process equipment that specializes in ultra-thin core and ultra-fine line production. Fabtech features high impingement sprays, finely controlled oscillation, glass lids, double door containment on ammonia etchers, ultra-thin core conveyor system, touch-screen PLC controls, Serfilco pumps and process technology heaters. Fabtech lines include ammonia, ferric and cupric etchers; dry film and LPI developers; strip lines; complete D-E-S & S-E-S lines; stainless desmear lines; and alternative oxide lines. Service and support is handled in North America by Advanced West (714) 541-9600.


Associated Rack Corp. -- Booth #402



In our repertoire of rack designs, we have increased our capabilities to provide our customers with the flexibility of adjustable baskets. We have utilized all sizes and shapes of materials to manufacture generic and custom racking used throughout the printed circuit industry. Associated Rack is the nation's largest supplier of PC tooling, and has manufacturing and sales offices nationwide. To review your present tooling, and find how adjustable baskets might benefit your operations, contact us in advance to arrange time at the booth with one of our engineers.


Baker Technology -- Booth #451



WST, Baker Technology's unique "mixed-frequency" pulse plating system provides superior results with value-added, advanced technology (thick, high aspect ratio, multi-featured) boards. WST's ability to plate uniformity on varying size holes/vias at higher ASFs, is umatched, and has been successfully demonstrated with numerous pulse chemistries. Many, fully automated reference sites exist with considerable history.


Camtek Ltd. -- Booth #1460



Camtek Ltd. will introduce a new series of Data Direct Imaging System by PENTAX: DI-2050, a fully automated cost-effective system, employing the cutting edge solid-state UV laser technology, which supports the mask-less flexible manufacturing process. It can image large panels, up to 24 x 36 inches, with high speed and high alignment accuracy.


Cemco-FSL -- Booth #637



The Cemco-FSL Hole Blaster is an essential addition to any circuit board fabrication shop. The system reduces panel defects caused by ineffective cleaning after drilling. It is the first system of its kind to adopt advanced air knife technology to remove debris from holes and surface topography. The system can be seen at the forthcoming IPC Expo 2002.


Cimnet Systems -- Booth #1109



Engenix (TM), the next generation engineering software solution, provides a comprehensive set of tools for the engineering department. Engenix performs three tasks to enhance the engineering function: 1) automation--translates procedures into rules-based functionality which produce consistent and accurate travelers and stack-ups with optimal on-hand material usage; 2) integration--consolidates all engineering data into one centralized hub with open integration to CAM and ERP systems, and; 3) collaboration--keeps the entire engineering process on track using built-in collaborative and communication tools, which permit a team to work on a single job.


Dosco Products -- Booth #439

Dosco Products will exhibit new back-up and entry material, as well as copper clad laminates. Also on display, new Piergiacomi equipment, AMM20 innerlayers registration machine, DAL10 for perfect sequence of layers at lay-up station, IPM25 Post-etch Driller for reference holes of innerlayers, and AFM30 machine to automatically level warped boards.


DuPont Electronic Technologies -- Booth #2050



DuPont Electronic Technologies invites you to "Picture the Future" at IPC Expo. When we mix a palette of innovative new products including printed, flexible and ceramic circuit materials, with a knack for integration and close teamwork with fabricators, together we can create exactly the kinds of powerful, portable devices OEMs imagine


Eidschun Engineering -- Booth #1734

The "Metalizer" is an advancement in electroless copper deposition for blind via, small hole and high aspect ratio product. The Metalizer's unique design produces up to 60 pph from its 12 x 8 ft. production platform. The Metalizer provides unattended automation including storage queues, giving you a competitive edge for high-tech manufacturing.


Electrochemicals -- Booth #717



Electrochemicals Inc. will introduce CO-BRA Bond (TM) HL, a high loading, low copper removal process for multilayer bonding, and an expanded line of photoimageable solder masks, hole plugging pastes and inks from Lackwerke Peters. The company offers a complete line of PWB processes and specialty chemicals including Shadow(R) Direct Metalization.


Frontline PCB Solutions -- Booth #2024



Frontline PCB Solutions is presenting the e-quote, a cost-based quotation package for PCB manufacturers. e-quote provides quotations for instant transmission to customers through the Internet, based on rules-driven accurate costing. e-quote integrates seamlessly with Frontline's Genesis 2000 CAM system for precise, fast and automatic retrieval of product variables.


Hendor-PE Inc. -- Booth #203



Reverse Pulse Rectifiers. Plating Electronic will be displaying their new generation of Reverse Pulse Rectifiers at the IPC show. These units have both the square wave and complex wave form capability. The size of these water-cooled units has been reduced approx. 50% while improving efficiency.


Industrial Dynamics -- Booth #1901

Industrial Dynamics introduces multi-head LP Series drillers utilizing 250K RPM ZindlesT and revolutionary Asynchronous Drilling Technology (ADT). ADT provides unprecedented flexibility, drilling six 18" x 24" panels or three 24" x 37" panels or any single panel up to 37" x 74", all in an ultra-compact footprint


Isola Laminate Systems -- Booth #647

Isola Laminate Systems brings several material innovations to the market this year: IS410, a thermally stable, CAF resistant FR-4 for broadband and networking applications; IS620, a low-loss dielectric for high speed digital PCBs; and Laserpreg (TM), a family of laser drillable prepregs. Stop by our booth for a quick overview or in-depth discussion on these new substrate materials.


Lavenir -- Booth #537

Come join Lavenir for a demonstration of the Jetmask "Direct Legend Printer," the first fully integrated solution to produce legend direct from data. Trained staff will also be on hand to present the latest versions of our CAM and Test software and our Pulsar Photoplotters.


MicroCraft -- Booth #315



Microcraft will be exhibiting "The Spyder Series" Moving Probe Testers with performance speeds of up to 3,000 HPM. System versatility includes buried-resistors, HiPot, cavity and automated verification. Automated TDR, testers capable of testing 30-micron pads and others with up to 32" x 48" test fields. MicroCraft is sure to have a system to meet your needs


Multiline Technology -- Booth #735



Multiline Technology will be showing new X-Ray tooling and inspection systems with layer analysis. Layer misregistration can be minimized by using X-ray to locate internal copper images and drill new tooling holes for pinning on the drill machine. Also included in all XRTs is LAP software (Layer Analysis Package) which reports if any layers have shifted, and by what amount. High layer counts up to 0.400 thick panels, large format to 36" x 60", and the new four-camera vision system are all available in the XRT series of X-Ray machines.


New System srl -- Booth #1864



New System's Ink-Jet Soldermask Printer is the first single-step direct soldermask printer on the market which is the cost-effective alternative to the conventional soldermask application process. Features include instant set-up, works directly from input Gerber data; sophisticated advanced chemical, mechanical and system engineering technology simplifies PCB fabrication by laying the soldermask directly onto the board without photo-tooling, soldermask stencils, drying and UV photoprinting processes; eliminates the problem of space and the production of hazardous waste; great savings in use of product; user-friendly, minimum training required.


Park/Nelco -- Booth #1950

Park/Nelco is launching the N4000-7 FR-4 substrate system in North America with manufacturing in California and New York. The N4000-7 series of laminate and prepreg provides PCB manufacturers with a CAF-resistant, dimensionally-stable material that is cost-effective and easier to processes than many of today's high-Tg materials.


Schmid Systems Inc. -- Booth #1722



Conveyor Lifting System I: For printed circuit boards with a thickness from 50Km to 15 mm (2 mil to 600 mil). PCBs with a thickness from 50Km to 15mm can be processed in the same line without any time-consuming re-settings. Conveyor Lifting System II: To avoid damage in "fine-line production" caused by the transport system, the whole upper roller system is lifted to assure that no roller touches the boards. The friction and adhesion of fluid is sufficient for a smooth transport


Sentrex -- Booth #1749



Copper-Gard(TM) Protected Copper Foil from Sentrex is a revolutionary new patent-pending product designed to protect and guard copper foil from the reject-causing agents that cost you time and money. By completely encapsulating the copper surface from exposure to dirt, resin dust, and airborne particles, Copper-Gard provides the complete protection needed to optimize first-pass yields and dramatically reduce rejects.


Shima American Corp. -- Booth #849

Shima American has been the distributor for PVA sponge rollers to the PCB market for over 15 years, and now offers new and improved polyurethane rollers to the market. The polyurethane rollers never harden, provide excellent absorption, wear and chemical resistance for printed circuit applications. Low cost of ownership, high performance and quality are the trademarks for all Shima products. Shima is ISO 9002 registered, has global pricing, and vendor-managed inventory.


Technic Inc. -- Booth #339

Technic is a turnkey chemistry and equipment supplier committed to total process support, a comprehensive product line, and process control hardware for PCB fabrication. It is the exclusive North American representative for Alfachimici and Schlotter, offering hoist systems for innerlayer, electroless copper and electroplating, TAB platers and continuous vertical processing systems for PCBs and flexible circuits.


TecNu Inc. -- Booth #2132



TecNu Inc. provides a complete portfolio of advanced power supplies for electrochemical applications. TecNu's high performance DC, pulse, pulse reverse and wave sequencing power systems are designed for consistent, reliable and error-free operation. This product maximizes standard features, instrumentation and user ergonomics, ensuring compliance to world-class quality standards, and the ability to achieve excellent results on PTHs, high aspect ratio holes and blind-vias.


Test Technology International -- Booth #1944



Test Technology International Inc. (Carson City, NV) will showcase the cost effective TTI Series 5800, 70-mil, 57,600 point, 14.4" x 10", double sided, universal grid tester. This system features color touch screen operation, on-board verification, and efficient throughput of dense product designs. Stop by our booth for a demonstration.


W. L. Gore -- Booth #305

Gore launches MICROLAM 600 Series Microvia Dielectric products with optimized electrical and mechanical properties. The materials are toughened to ensure superior reliability in cell phones, PDAs, and other portable devices. They pass new handset OEM drop tests, meet critical environmental tests for chip packages, and offer very low loss characteristics for RF modules. Visit www.gore.com/electronics for more information.


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