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 | Eclipse Direct Metallization
MacDermid Eclipse is the next generation direct metallization process, engineered specifically for fabricators and OEMs that require consistently high performance, reliability and durability. Simpler to use and considerably more cost-efficient than electroless copper, Eclipse provides high tech capabilities and RoHS-compliance all in one.
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 | MacuSpec VF 100 Electrolytic Copper Metallization
MacDermid MacuSpec VF 100 is a unique, production proven process that is specifically engineered to be the most effective method to simultaneously plate through holes and fill blind microvias in one bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, it eliminates an entire process sequence for greater application flexibility, while increasing overall bath life 400%.
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 | Sterling Immersion Silver Final Finish
MacDermid Sterling is the #1 immersion silver surface finish, specified by hundreds of fabricators, assemblers and OEM’s worldwide to provide consistent solderability, low contact resistance, process simplicity, and long shelf life.
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 | M-Coat HT Organic Solderability Preservative
MacDermid M-Coat HT is the next generation high performance OSP designed specifically to provide fabricators, assemblers and OEM’s with the consistent finish that will endure multiple, high temperature Pb-free reflow cycles.
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 | MultiBond Innerlayer Bonding System
MacDermid MultiBond is the leading technology for inner layer adhesion promotion designed specifically to perform at the high temperatures required for today’s lead-free soldering of circuit boards.
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 | MicroCat Emerging Technologies
Introducing MacDermid MicroCat, the only combined printing and plating process utilizing proven technology that can satisfy the demand for high volume advanced circuitry — at a uniquely low cost. An evolution of additive circuitry technology that eliminates critical barriers to the global penetration of RFID, MicroCat delivers the superior performance, supported by worldwide resources, that you expect from MacDermid.
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 | The Chemical Transition: Enabling Solar Power Efficiencies
The Solar Energy transition is underway. As the industry reaches toward grid parity, chemical processing will deliver the cost, processing and efficiency advantages to get us there. MacDermid Inc., a world leader in specialty chemicals, brings cutting-edge innovation and world-renowned technical service excellence to your facilities, anywhere, anytime. Our turn-key chemistry and equipment packages enable the efficiency gains you need to win the brightest of futures.
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 | CoreSystems Innerlayer Processing Systems
MacDermid CoreSystems is a complete package of innerlayer processing chemistries assembled specifically for fabricators that want to increase productivity, performance and yields at every stage during the manufacture of multilayercircuit boards.
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 | MacuSpec PPR Electrolytic Copper Metallization
MacDermid MacuSpec PPR is the electroplating process trusted worldwide by fabricators that demand precise thickness uniformity and overall productivity unattainable by conventional acid copper plating.
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 | Aqua Mer Dry Film Photoresist
MacDermid Aqua Mer is the family of dry film photoresists designed specifically to produce the highest yields possible during innerlayer and outerlayer processing, laser direct imaging and final finish processing.
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 | StanTek PC 1000 Component Finishes
MacDermid StanTek PC 1000 is the matte tin and tin/lead process developed specifically to satisfy the increasingly stringent plating needs of passive component platers.
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 | StanTek BT 3000 Component Finishes
MacDermid StanTek BT 3000 is the bright, pure tin plating process formulated specifically for the harsh demands of today’s Pb-free applications. Designed for reel-to-reel applications, the BT 3000 finish endures the intense thermal and corrosive environments of lead-free assembly.
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 | Planar Electroless Nickel Immersion Gold
MacDermid Planar is the electroless nickel immersion gold plating process designed specifically to increase yields through the elimination of extraneous and skip plating, while minimizing the risk of black pad. Favored by fabricators, assemblers, and OEM’s because of its stability and reliability, Planar is the choice for critical end-use applications.
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 | M-System Omega Electroless Copper Metallization
ABS. Satellite transmission systems. Data storage servers. Heart monitors. Wireless communications devices. For these and thousands of other everyday applications, reliability is what separates the winners from the losers. Without it, today's conveniences and tomorrow's innovations couldn't exist.
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 | Microtrace Liquid Photoresist
MacDermid Microtrace is the advanced liquid photoresist designed specifically to produce higher yields and volume production at the lowest cost possible for innerlayer image formation.
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 | M-Copper 15 Electroless Copper Metallization SM
MacDermid M-Copper 15 is the thin deposition electroless copper developed specifically for fabricators that require process flexibility and reduced overall chemical costs in the development of their super thick circuit boards.
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 | MacStan HSR 3.0 Immersion Tin Final Finish
MacDermid MacStan HSR 3.0 is the immersion tin plating process designed specifically to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months.
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 | M-Coat Organic Solderability Preservative
MacDermid M-Coat is the organic solderability preservative designed specifically to provide fabricators, assemblers and OEM’s with consistent solderability performance through multiple reflow cycles.
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 | Blackhole Direct Metallization
MacDermid Blackhole is the choice of fabricators worldwide that prefer a low cost, environmentally friendly direct metallization alternative to electroless copper. Suitable for both simple and complex circuit boards, carbon-based Blackhole is a nanoscale electrostatic coating that satisfies every need for reliability and versatility.
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