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M-Copper 15 Electroless Copper Metallization SM

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The Most Flexible And Cost-Efficient Solution For Metallizing Any PCB, from Thin Core To Backpanel

MacDermid M-Copper 15 is the thin deposition electroless copper developed specifically for fabricators that require process flexibility and reduced overall chemical costs in the development of their super thick circuit boards.

M-Copper 15, able to plate 15 microinches in 15 minutes, is impervious to bath loading and can be utilized in either basket mode or 1-up in-line for ultimate flexibility. With a loadfactor of 0.20 – 1.75 square feet per gallon, the reduced amount of chemicals used in the plating bath enables each shipment to last longer. Highly reliable, M-Copper 15 is engineered for low deposit stress, resulting in superior hole wall adhesion. It also features lower hydrogen evolution,which delivers a more uniform electroless copper deposition in the center of high aspect ratio holes. Using the same activation sequence as our renowned M-System products,M-Copper 15 is the right choice for all of your highest technology circuit board projects.

When it comes to electroless copper metallization, count onthe company that says “Yes We Can.” MacDermid.


Key Features

  • Low deposition copper thickness
  • Outstanding performance for all levels of technology; ideal for circuit boards of 40 layers or more
  • Process flexibility: basket or 1-up, in-line
  • Reduces overall chemical usage
  • Low deposit stress for superior hole wall adhesion
  • Maximizes cost efficiency


Ultimate Process Flexibility: Basket Or 1-Up, In-Line Mode

MacDermid M-Copper 15 delivers the highly reliable, low stress electroless copper metallization process you can trust for all of your highest technology circuit board needs. Able to be processed in basket or 1-up in line mode, M-15 plates a uniform consistent deposit at load factors that vary from 0.20 square feet per gallon to 1.75 square feet per gallon. This ultra stable thin deposition electroless copper bath not only provides superior hole wall adhesion, it reduces overall chemical usage.As part of the M-System family, it offers advantages on multiple levels throughout circuit board design, manufacturing and reliability.


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