The Choice For Exceptional Adhesion On Interconnect Copper

ABS. Satellite transmission systems. Data storage servers. Heart monitors. Wireless communications devices. For these and thousands of other everyday applications, reliability is what separates the winners from the losers. Without it, today's conveniences and tomorrow's innovations couldn't exist.

At MacDermid Electronics Solutions, we're making sure they do. And M-System Omega—our next generation through-hole metallization process—is leading the way. Engineered to meet the latest end-user reliability criteria of 10-times solder shock and higher Interconnect Stress Test (IST) cycles to failure, it's no wonder that board fabricators and OEM's worldwide consistently turn to MacDermid for their critical applications.

The Advantages Are Clear

M-System Omega combines patented chemical technologywith statistical experimental design to provide the highestdegree of copper-to-copper adhesion, resulting in completecopper continuity, increased circuit density and smallerthrough-holes and microvias.

Traditional conditioning systems rely upon film-formingsurfactants to electrostatically attract catalyst, but films cancreate weak barrier layers between copper surfaces.M-System Omega is engineered specifically to eliminateweak barrier layers, while producing consistently cleancopper surfaces.The bond between the interconnectand the electroless copper is so strong, that the HTE foilwill actually fracture before an interconnect failure occurs.

The end results for you and your customers are significant:with interconnect failures eliminated there are lessmalfunctions, which means less consumer complaints, lessend-use product returns and higher overall satisfaction.

Evolution Of A Proven Process

M-System Omega is the latest generation of MacDermid’sM-System, our proven metallization process that is trustedworldwide for its pretreatment-through-applicationmethodology. For more than a decade, M-System hasprovided users with superior coverage for defect-freesolderability, and long lasting, reliable adhesion.

M-System Omega maintains the same pretreatmentsteps as its predecessor.Our M-Permanganate Treatmentand patented MacDermid Regeneration System provideconsistently reliable desmear, as well as the maximumsurface topography for the full range of laminate materials.Our patented M-Condition technology for covalent bondingwith glass provides exceptional electroless coppercoverage on dielectric. And our M-Accelerate chemistryprovides a uniformly-active layer of catalyst for consistent,reliable electroless copper initiation.

From start to finish, M-System Omega is your onlychoice for reliable interconnect adhesion.

The Industry’s Highest Level Of Copper-To-Copper Adhesion

M-System Omega is the next generation through-hole metallization process perfected by MacDermid Electronics Solutions.

Statistically engineered to eliminate the key causes of interconnect failure and voiding, M-System Omega providesthe industry's highest level of copper-to-copper adhesion, and unparalleled electroless coverage on advanced resinsystems.This enables increased circuit density and smaller through-holes and microvias.

For the interconnect reliability trusted by board fabricators and OEM’s worldwide, count on the company that says“Yes We Can.”MacDermid.