Reliability And Stability From A Single High Yield ENIG Plating Process

MacDermid Planar is the electroless nickel immersion gold plating process designed specifically to increase yields through the elimination of extraneous and skip plating, while minimizing the risk of black pad. Favored by fabricators, assemblers, and OEM’s because of its stability and reliability, Planar is the choice for critical end-use applications.

Planar’s patented catalyst systems are what separate Planar from the competition. They selectively metallize copper surfaces only; this directly eliminates both extraneous and skip plating. Formulated by the industry experts in black pad elimination, its high performance nickel phosphorous structure resists corrosion and is exceptionally compatible with soldermasks. Combined with our full range of electroless nickel products, Planar provides a durable, extremely flat deposit ideal for fine pitch SMT, BGA and direct-chip attach assembly.

When reliability, stability and high yield are critical, count on the company that says “Yes We Can.” MacDermid.

Key Features

• No plating on laminate or solder masks
• No skip plating
• Nickel structure that resists corrosion
• Patented technology to overcome harmful solder mask effects
• Formulated to prevent black pad
• Excellent solderability, contact resistance and wire bondability
• Simplified bath control

Planar: From The Leader In Final Finishes

For more than 10 years, MacDermid has been a leader in electroless nickel immersion gold. And when it comes to reliability, stability, and high yield from a single ENIG plating process, look no further than MacDermid Planar.

Specified by fabricators, assemblers, and OEM’s worldwide, Planar is a superior HASL alternative designed specifically to minimize the mechanisms that can lead to black pad while reducing extraneous and skip plating. Reduce failure rates throughout the entire process with Planar, from the leader in final finishes.