MacDermid MacuSpec PPR is the electroplating process trusted worldwide by fabricators that demand precise thickness uniformity and overall productivity unattainable by conventional acid copper plating. Designed to work more effectively on today’s multilayer PCB’s, it can easily meet the most challenging plating specification.
Part of MacDermid’s family of electrolytic copper plating processes, MacuSpec PPR delivers a more consistent electrolytic copper deposit in a shorter amount of time than is possible with traditional DC methods, thereby enabling users to increase overall output. It allows plating of a desired thickness in the center of the hole while plating less on the outer surface of the printed circuit board, greatly reducing the consumption of copper anodes and solder mask. Uniform copper distribution allows a reduction in dry film thickness, resulting in lower operating costs. MacuSpec PPR also successfully plates high aspect ratio through-holes and blind microvias simultaneously, without the need for multiple plating cycles. Its superior throw into high-aspect ratio through-holes can reduce plating time up to 70%.
When you need a quantum improvement in thickness uniformity and productivity, count on the company that says “Yes We Can.” MacDermid.
Key Features
Exceptional thickness uniformity
Reliable thermal cycle performance
Superior throw into vias: up to 70% cycle time reduction
Reduced consumption of copper anodesand solder mask
The right choice for today’s thicker, high density panels
Achieve Your Plating Goals While Minimizing Cycle Time
MacDermid, a leader in electroplating technology, offers MacuSpec PPR and PPR 100 as optimal solutions for fabricators that require thickness uniformity at the lowest possible cost. With superior throwing power into blind microvias and high aspect ratio holes, MacuSpec PPR is the perfectly engineered alternative to conventional acid copper plating.
