The Total Systems Responsibility Package For Innerlayer Processing

MacDermid CoreSystems is a complete package of innerlayer processing chemistries assembled specifically for fabricators that want to increase productivity, performance and yields at every stage during the manufacture of multilayercircuit boards. Supported by MacDermid’s dedicated on-site service program, our total systems responsibility approach isthe ideal combination of technological expertise and proven innovation in circuit formation.

CoreSystems is the most reliable way to ensure that the chemistries used in each processing stage are perfectly compatible with each other, from the initial step of cleaning the copper to the application of innerlayer bonding chemistry. Customers also benefit from cost efficiencies, less troubleshooting, reduced downtime, and an unbreakable commitment that all responsibility for innerlayer processing performance will be managed by MacDermid. And with ourwide ranging industry experience, you will be kept up to dateon all new technologies that could affect your business. An exceptional choice for high density fine line circuitryapplications, CoreSystems from MacDermid is your complete solution.

For the total innerlayer processing chemistry package, count on the company that says “Yes We Can.” MacDermid.

Key Features

• Improved performance, reliability and yields
• Total cycle responsibility
• Maximizes speed and consistency
• Reduced troubleshooting, down time and maintenance
• Fully compatible, sole-source chemistries

From Start To Finish, MacDermid Orchestrates Everything For You

CoreSystems is the total systems responsibility package for innerlayer processing that provides fabricators with the predictability and peace of mind they need to compete successfully. Especially suited for high density fine line circuitry, CoreSystems is a bundle of chemistries whose unique compatibility ensures higher yields and improved performance throughout every stage of the manufacturing process.