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The Cleanroom Paradigm

February 14, 2007

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Conventional wisdom suggests that as we go to higher and higher standards of cleanliness (Class 1000, to Class 100, to Class 10) we should be getting fewer and fewer defects in the photolithographic structuring of PWBs that are related to contamination of the yellow room. A look at the ISO (and FED) cleanroom classification definitions suggests that as we go to cleaner rooms, for all practical purposes only sub-micron airborne particles are tolerated in limited concentrations.

 

The likelihood of a particle remaining suspended in air depends upon its size, shape and density, but in general, particles that are larger than 1 micron don’t remain suspended in air very long, even under conditions of turbulent flow. Now, the particles that we worry about most, are those that are of a size comparable to the circuit feature size. For fine line circuits, e.g. 25 micron lines and spaces, we would worry about 7 micron size or larger particles because they could cause defect sizes in the range of line and space violation limits (e.g., 30% of nominal feature size). But these particles are typically not airborne and therefore not measured. And cleanroom classifications don’t address particles larger than 5 microns. Not only that, going to more stringent classifications, i.e. spending more money, only reduces particle count of particles that don’t matter. It seems to me, what matters is the elimination of dragged-in large particles on the board surface, and the deposition of large particles that originate from human interaction.

US FED STD 209E Cleanroom Standards

particle/ft³ 

Class

0.1 µm

0.2 µm

0.3 µm

0.5 µm

1 µm

5 µm

1

35

7

3

1

 

 

10

350

75

30

10

1

 

100

3500

750

300

100

10

1

1,000

 

 

 

1,000

100

10

10,000

 

 

 

10,000

1,000

100

100,000

 

 

 

100,000

10,000

1,000



NOTE: US FED STD 209E was canceled November 29, 2001.
Reference: http://www.iest.org/publctns/fedstd209.htm




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