Rogers, Conn. – Rogers Corporation’s Advanced Circuit Materials Division will exhibit its RT/duroid® high frequency materials and its RO3000® and RO4000® laminates at the IEEE Radio & Wireless Symposium in San Diego during Radio & Wireless Week, January 19 to 20. RT/duroid materials at Rogers’ booth (#15) will be RT/duroid 5000 and RT/duroid 6002, as well as the newest addition to the RT/duroid family of high frequency materials, RT/duroid 6202PR for use in designing complex microwave structures such as antennas and multilayer circuits with interlayer connections. The new RT/duroid 6202PR material offers the same electrical and mechanical properties as RT/duroid 6202 in addition to enabling tight tolerance planar resistors when clad with resistive copper foils.