Advertisement:
  LoginNew User? 
Forgot Password 
  Home
  Subscribe
  Updates
  Audio Podcasts
  Videos
  Latest News
  20th Anniversary Perspectives
  Columns
  Features
  Classified Ads
  Calendar of Events
  Ad Index
  Web-Only Editorial
  CircuiTree Blog
  Resources
  Archives
  Buyers Guide
  Circuit Board Forum
  Industry Links
  List Rental
  Showrooms
  Market Research
  Webinars
  CT Info
  About Us
  Advertising Sales
  Contact Us
  Editorial Submissions
  Media Kit
  Reprints
  Special Collections
  The Board Authority
Search in: EditorialProductsCompanies
View From The Middle: Lean Sigma Part IX Must be a registered user to see this item

The topic Voice of the Customer always creates some confusion in the context of lean practices. Although there should be no disagreement on the point that everything starts and ends with the customer, people typically have a difficult time connecting the dots between the customer and process improvement during the early stages of lean implementation. But I would argue that before you can define your process defects and opportunities, you need to understand the needs of your customers.


by Steve Williams


My Line: Hall Pass Must be a registered user to see this item

Ripping on IPC by industry press is a pretty easy thing to do and is something that is done with a fair amount of regularity. As former staff of the organization, I’ve had my moments where it would have been juicy to lay into them, but I choose to keep objectivity in order.


by Chris Jorgensen


Tech Talk: Fine Lines in High Yield (Part CLll): Immersion and Electroless Metallization Processes Must be a registered user to see this item

The term electroless, as in electroless nickel process, is a curious one and has led to considerable confusion. In its literal meaning, it labels processes that proceed without applying an external electrical potential to drive the reaction. Thus, the English language defines electroless processes by what they are not, namely, electroplating processes driven by an external potential.


by Karl Dietz


Flexible Thinking: Back to Basics Part 21 – Polymer Coatings for Flexible Circuits: Basic Coverlayer and Cover Coat Issues Must be a registered user to see this item

Those who have followed this series from the beginning will recall that there are several types of flexible polymer insulation cover coating systems available. Each of the materials accounted for in those discussions has its own advantages, drawbacks, and special areas for application. The basic forms of polymer coatings are adhesive-backed polymer films, screen-printable liquid cover coats, and photoimageable liquid and film polymers.


by Joseph Fjelstad


Fein Lines: Government Relations = Profit Must be a registered user to see this item

Are those of you who have P&L statement responsibility taking advantage of the R&D tax credit available to you? Did you know that you may be able to claim a tax credit, not a deduction but a credit, of tens or even hundreds of thousands of dollars? Do you know what the R&D tax credit actually is? Do you and your staff know how to stay up to date on issues such as this while doing your strategic planning? Well, let’s be sure.


by Dan Feinberg


Happy Thoughts: Have You Considered the New Markets of Solid-State Illumination? Must be a registered user to see this item

By now I’m sure you have noticed that light emitting diodes (LEDs) are beginning to show up everywhere in our everyday life. I think it is a BIG deal when high brightness (HB) LEDs start to appear in our Maglite1 flashlights! This is the brave new world of solid-state lighting (SSL).


by Happy Holden


Market Outlook: Resilience: Electronic Equipment Demand Holds in a Difficult Economy

The global electronics industry took a hit in early 2008. A combination of U.S. financial woes (which ultimately impacted consumer and business spending worldwide), the normal post-Christmas seasonal consumer electronics slowdown, Lunar new year plant closings in Southeast Asia, and heavy February snows in China combined to create a sharp downturn throughout the food chain. World PCB production plunged in January and February (Chart 1) and semiconductor shipments followed suit (Chart 2). The chip shipment downturn (dollar value) was further amplified by severe DRAM price degradation.


by Walt Custer
Jonathan Custer-Topai


Ask The Flexperts: The Pros and Cons of Tool Selections Must be a registered user to see this item

Why is there such disparity in tooling setup charges from model to model? Are there more cost-effective tooling choices for final trim?


by Mark Finstad
Joseph Fjelstad
Mark Verbrugge


Shop Talk: A Personnel High in the Rockies Must be a registered user to see this item

In this new column, CircuiTree will highlight North American PCB shops. As these shops battle to keep their customer base, there are stories to be told of how they came into business, how they stay in business, and the philosophies that keep them moving. If you would like to have your company featured in this column, contact Stephanie Church (stephanie@circuitree.com).

by Chris Jorgensen


Circuits Unusual: Area Array Packaging—Then and Now Must be a registered user to see this item

High-volume packaging was presumably launched during WWII, when ceramic modules were mass-produced for proximity bomb fuses. Alumina (Al2O3) was found to be a highly robust substrate and is still widely used today.


by Ken Gilleo














Subscribe Now! Subscribe to Circuitree
Circuitree is the only global magazine to focus on the printed circuit board! Monthly editorials exclusively provide info for circuit board fabricators, suppliers and OEM customers. Subscribe Today!
Subscribe


Advertisement:
© 2008 BNP Media. All rights reserved. | Privacy Policy