Fig 1 Introducing Boundary Concerns
Incrementally While Doing Layout
To
say that we are in "uncertain times" is an understatement.
But, we have a couple of things going for us PCB designers:
electronics continues to innovate and solve problems—at a lower
cost—and companies need to create new products to pull themselves
out of this recession! The question is, Will you be part of that
solution? Three business fundamentals drive most management and here
is how you can contribute to:
facilitating lower PWB
costs
improving performance and
suggesting innovations
reducing schedules and
providing "right-the-first-time" layouts
The key is to be the ‘last one
laid-off’ by:
making yourself
"invaluable!"
being more flexible and
capable of doing more jobs than anyone else
being part of your company’s
need to create new products if they want to "pull"
themselves out of the recession
helping to change old
paradigms. The time is now!
My first assumption is that "If
you knew the answers, you would be using them!" So, this calls
for "learning something new!" Or, now is the time to "learn
from the best." Here are some of my suggestions:
Facilitating lower PWB costs
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To lower PWB costs, there are three
ideas for low-layer count boards and two for high-layer count boards.
These fall into the arenas of DFM, newer materials, panelization, and
BGA breakout.
Fig 2 (u.) Panelization of Three PNs
(l.) Panelization of Two PNs
For boards <= 12-layers:
learn about new laminates from Asia
practice DFM
panelization of different PNs
For board’s > 12-layers:
lower layers with new BGA breakout
(see my CircuiTree column from March 2009)
try HDI to lower layer count
Material and layer counts are the
second- and third-largest cost drivers for printed circuit
fabrication. Reviewing the laminate that the PCB is fabricated with
and considering newer laminates from Asia that could be less
expensive is a way to save on costs. Information on new materials is
in the HDI Handbook and on my Mentor blog[1]. Reducing the
layers on high-layer multilayers is sure to reduce costs, as well as
doing a thorough check for manufacturability to look for ways to
improve the fabrication yields.
Figure 1 shows the typical PCB layout
process. There are eight opportunities in this process to stop and
review the boundary conditions that affect cost, performance, and
reliability. Learning about these boundary situations permits the
opportunity to improve the process and the board. These critical
boundary arenas are:
ECAD/MCAD interfaces
Signal and Power Integrity
EMI/RFI concerns
Thermal issues
DFM
Volume of the PCB fabrication order is
the number one cost driver. One way to increase the order volume is
to panelize more than one part number on the fabrication panel. This
is something that you have to do, as it involves inventory,
assembly, and test. But, as seen in Figure 2, if executed properly it
offers the largest opportunity to reduce costs.
Improving performance and suggesting innovations
Improving performance is a large topic.
But, a critical area is high-frequency electrical performance for the
board in both signals and plane PDN. I would like to describe some of
the work we have done at Mentor to help customers improve SI and PI.
Other new trends are incremental design/validation methodologies and
the improved use of constraint-autorouting, as well as re-use of
circuits and DFT.
Here is where I suggest that you start
looking for where you can learn these new topics. First, if you have
not downloaded my new HDI Handbook, this is a good place to start.
(This e-Book is available as a free download [1].)
Chapter 4, "HDI Electrical Performance," is written by Dr.
Eric Bogatin and he has many more resources available for learning,
including 105 documents, lectures, and tutorials from his Web site.
(His past Web series, "No MYTHS Allowed," is also available
for download.)[2] Figure 3 shows a
typical slide form one of his lectures. Dr. Bogatin’s current
Internet site is http://www.BeTheSignal.com and it
also has many free tutorials[2].
Another very useful design "toolkit"
is provided by Kenneth Wood, owner of Saturn PCB Design in Deltona,
Fla. His toolkit is shown in Figure 4 and provides software to
calculate physical and electrical characteristics of vias and
conductors; signal bandwidth and max. lengths; differential-pair
impedances; padstack designs; drill/wire gauge conversions; min
conductor spacing for voltages; and microstrip/stripline
impedances.[3]
Fig 4 Saturn PCB Design, Inc. Has
Free S/W to Use During Layout
Another source of training and
learning is to use Google and Yahoo to search the Internet for
college classes in signal integrity, EMI Compliance, Design for
Manufacturing or high-speed design. One such search yielded the
EE166: High-Speed PCB Design course at Harvey Mudd College in
Claremont, Calif. HMC has the distinction of being awarded as "One
of the Top Undergraduate Engineering Schools in the U.S." In
this case, it was the lecture notes and labs by Prof. Sarah
Harris[4].
The IPC Designers Council and the IEEE
are constantly running courses for designers.
Reducing schedules and providing "right-the-first-time" layouts
Last, to reduce schedules is one of
"push left," "do it right the first time," and
distribute more activities in parallel. Move critical activities and
checks/audits up earlier in the design process. Find any problems or
mistakes early. IF [errors] found in manufacturing, critical
schedules and costs are bound to be impacted. Now is the time to
"learn to use the autorouter correctly" and "how to
apply signal and power integrity!"
Summary
Finally, if you are "surplused,"
"made redundant," "sacked," "displaced,"
"sacrificed," or just "let go," Mentor has the
Displaced Worker Program.[5]
You may take Mentor classes on a space-available basis, for free, and
that includes online courses as well as in-class courses in Austin,
Boston (Marlborough, Mass.), Chicago, Minneapolis, Dallas, Denver
(Longmont, Colo.), Portland (Wilsonville, Ore.) and San Jose.
Happy T. Holden is the new CTO for Foxconn's MIP Business Group, which manufactures many different types of printed circuits for consumption by Foxconn's various business groups
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