Endicott, N.Y. – Endicott Interconnect Technologies was awarded a USD 148.6 million contract modification from the U.S. Department of Defense. The modification is for the continuation of the current program to produce card frame assemblies, including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, PCBs, functionally tested circuit board assemblies, and engineering services in support of a high-reliability, high-performance computing application.