Santa Clara, Calif. – Intel Corporation, Samsung Electronics, and TSMC reached an agreement on the need for industry-wide collaboration to target a transition to larger, 450 mm-sized wafers starting in 2012. This transition would enable the continued growth of the semiconductor industry and help maintain a reasonable cost structure for future IC manufacturing and applications. Intel, Samsung Electronics, and TSMC will cooperate with the semiconductor industry to help ensure that all the required components, infrastructure, and capability are developed and tested for a pilot line by the target date.