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IPC Releases PCB Industry Results for June

July 29, 2008

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Bannockburn, Ill. – IPC released the June findings from its monthly North American PCB Statistical program. Between June 2007 and June 2008, rigid PCB shipments were up 2.9 percent and bookings were down 4.5 percent. Rigid PCB shipments increased 5.8 percent and bookings increased 6.6 percent year-over-year. June 2008’s book-to-bill ratio for the rigid PCB industry slipped to 0.94. Flexible circuit shipments in June increased 8.9 percent and bookings increased 12.2 percent year-over-year. Year to date, flexible circuit shipments were up 4.2 percent and bookings were down 8.8 percent. Compared to the May 2008, flexible circuit shipments were up 15.8 percent and flex bookings increased 11.4 percent. The flexible circuit book-to-bill ratio continued to inch up to 1.02. For rigid PCBs and flexible circuits combined, industry shipments in June increased 3.3 percent from June 2007 and orders booked decreased 3.4 percent from June 2007. Year to date, combined industry shipments were up 5.7 percent and bookings were up 5.4 percent. Compared to the May 2008, combined industry shipments for June 2008 were up 12.0 percent and bookings were up 20.4 percent.  The combined (rigid and flex) industry book-to-bill ratio in June declined to 0.95.



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