Eclipse Direct Metallization
MacDermid Eclipse is the next generation direct metallization process, engineered specifically for fabricators and OEMs that require consistently high performance, reliability and durability. Simpler to use and considerably more cost-efficient than electroless copper, Eclipse provides high tech capabilities and RoHS-compliance all in one.
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MacuSpec VF 100 Electrolytic Copper Metallization
MacDermid MacuSpec VF 100 is a unique, production proven process that is specifically engineered to be the most effective method to simultaneously plate through holes and fill blind microvias in one bath. Developed for fabricators and OEMs that require increased productivity and faster ROI, it eliminates an entire process sequence for greater application flexibility, while increasing overall bath life 400%.
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Sterling Immersion Silver Final Finish
MacDermid Sterling is the #1 immersion silver surface finish, specified by hundreds of fabricators, assemblers and OEM’s worldwide to provide consistent solderability, low contact resistance, process simplicity, and long shelf life.
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M-Coat HT Organic Solderability Preservative
MacDermid M-Coat HT is the next generation high performance OSP designed specifically to provide fabricators, assemblers and OEM’s with the consistent finish that will endure multiple, high temperature Pb-free reflow cycles.
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MultiBond Innerlayer Bonding System
MacDermid MultiBond is the leading technology for inner layer adhesion promotion designed specifically to perform at the high temperatures required for today’s lead-free soldering of circuit boards.
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MicroCat Emerging Technologies
Introducing MacDermid MicroCat, the only combined printing and plating process utilizing proven technology that can satisfy the demand for high volume advanced circuitry — at a uniquely low cost. An evolution of additive circuitry technology that eliminates critical barriers to the global penetration of RFID, MicroCat delivers the superior performance, supported by worldwide resources, that you expect from MacDermid.
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A Novel Green Technology for the Plated Through Hole Process
Electroless copper has long been the dominate process for plated
through hole (PTH) metallization. The technology is widely used by
printed circuit board fabricators and driven by a long standing
acceptance by OEMs. However, this established technology has many
drawbacks that have a direct impact on our environment. Namely, it
contains a known carcinogen, consumes a lot of water and is inherently
unstable leading to increased demands on waste treatment operations.
Through the years there has been significant work done in this area of
the manufacturing process to overcome the challenges associated with
electroless copper technologies. The ultimate goal being an
environmentally friendly PTH process that maintains well established
performance and reliability standards.
by Ying (Judy) Ding
Richard Retallick
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The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode, and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses, they're more portable, and they're increasingly used in polluted areas. Worldwide industrialization has produced more sulfur, chlorine and nitrogen compounds that aggressively attack electronics. The initiatives to eliminate lead (Pb) in electronics reduced the ability for circuitry to resist corrosion. To replace thick tin-lead deposits more circuits employ thin, easily corroded surface finishes on the PCB, connectors, and component leads. There is a need for better prediction of service-life corrosion, yet there is a lack of adequate test methods. Environmental testing rarely progresses beyond thermal cycling or heat/humidity. Mixed flowing gas testing uses standardized pollutants as a stress to electronics, but has limited success in reproducing all corrosion failures. An elevated rate in the observation of one type of failure, termed creeping corrosion, motivated the electronics industry to review corrosion test methods. As part of the IPC 3-11g committee, a number of OEM's, EMS providers, PCB fabricators, material suppliers, universities, and testing laboratories joined forces to address the need for better corrosion prediction.
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