Market Outlook: We Are Growing Again! 2009
was a terrible year, but it closed in better shape. Global electronic
equipment shipment “growth” was negative for four consecutive
quarters (4Q08 to 3Q09), but it then “recovered” in the fourth
quarter of 2009 with an estimated 7 percent quarterly increase versus
4Q08 (Chart 10). To be fair, this 7 percent expansion was relative to
a very bad quarter of the prior year–but we are growing again!
by WaltCuster Jonathan Custer-Topai
Tech Talk: Fine Lines in High Yield (Part CLXXlV) Thermal Substrates There
are a number of electronic packaging applications that require
improved heat removal through heat conduction compared to what
standard laminates can provide. One distinguishes between active and
passive cooling. The three modes of cooling are radiation,
convection, and conduction that contribute more or less to passive
cooling. Increasing the surface area, e.g. with fins, will enhance
cooling by all modes.
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