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PODCAST – Blind Microvia Filling and Dow Electronic Materials MICROFILL EVF Copper Via Fill product

中文版

Mark Lefebvre, Research Manager
Dow Electronic Materials
mlefebvre@rohmhaas.com


Dairy Field Reports
Digital Edition Archives

Prototron: America’s Quick Turn Board Shop | - December 1, 2009
Web-Exclusive: Why Invest During a Recession? | - October 1, 2009
Parts Collaboration Within The SunstoneECOsystem: PCB123, LiveBOM, Digi-Key, and NXP - June 16, 2009
Market Outlook: We Are Growing Again!
2009 was a terrible year, but it closed in better shape. Global electronic equipment shipment “growth” was negative for four consecutive quarters (4Q08 to 3Q09), but it then “recovered” in the fourth quarter of 2009 with an estimated 7 percent quarterly increase versus 4Q08 (Chart 10). To be fair, this 7 percent expansion was relative to a very bad quarter of the prior year–but we are growing again!

by Walt Custer
Jonathan Custer-Topai

Tech Talk: Fine Lines in High Yield (Part CLXXlV) Thermal Substrates
There are a number of electronic packaging applications that require improved heat removal through heat conduction compared to what standard laminates can provide. One distinguishes between active and passive cooling. The three modes of cooling are radiation, convection, and conduction that contribute more or less to passive cooling. Increasing the surface area, e.g. with fins, will enhance cooling by all modes.

by Karl Dietz

Go to the CircuiTree TV page

It seems to me...Prospecting is part of selling
by Dan Beaulieu | March 8, 2010 | Comments (6)

A Response to Football, Beer, and PCBs
February 13, 2009 | Comments (0)

 • PCBs in the Medical Field
 • Market Outlook: We Are Growing Again!
 • Tech Talk: Fine Lines in High Yield (Part CLXXlV) Thermal Substrates
 • A Moment With Dan Beaulieu
 • New Developments in DC Acid Copper for Vertical Plating Tanks

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